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Job Description
As an integral part of Intel’s new IDM2.0 strategy, we are establishing Intel Foundry Services (IFS), a fully vertical, standalone foundry business, reporting directly to the CEO. IFS will be a world-class foundry business and major provider of US and European-based capacity to serve customers globally. Intel Foundry Services will be differentiated from other Foundry offerings with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe - available for customers globally - and a world-class IP portfolio that customers can chose from including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP, along with ARM and RISC-V ecosystem IPs. IFS will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry standard design packages. This business unit is completely dedicated to the success of its customers with full P and L responsibilities. This model will ensure that our foundry customers’ products will receive our utmost focus in terms of service, technology enablement and capacity commitments. IFS is already engaged with customers today starting with our existing foundry offerings and we are expanding imminently to include our most advanced technologies, which are optimized for cutting-edge performance, making them ideal for high-performance applications.

For the IFS HPC Vertical that we are building, we are looking for SOC Architects with in-depth Experience of SOC Design for HPC Space. The job responsibilities include translating high level customer specification into an Executable Architecture Specification with available internal/external IP and Intel Process Technologies/Packaging. He/she should drive the IP Selection including CPU, Mesh/Fabric, critical IO interfaces like DDR/HBM, PCIE controllers etc. He/she should drive right from Conceptual floorplan of SOC, Die Area, Package selection and should drive critical requirements like Clocking, Power Planes, Reset etc. He/she should work with SW teams on HW-SW partitioning and define detail HW feature set and also System integration strategy.



Qualifications

The right candidate will have track record of Architecting 2 SOCs in HPC space with experience in High Performance Computing/AI Technology.

He should bring-in around 15 years’ experience after Masters/Ph.D. degree and mist have in-depth digital design background. Must have thorough understanding on Computer Architecture, Multi-core architecture challenges, HW/SW layers associated, Mesh/Fabric and some understanding of DFT, HW/SW interfaces etc. Must be a strong communicator, mentor and approachable personality. Must be involved in Post-Si Debug issues, Timing Convergence challenges etc. Solid understanding of Power Management and power optimization at System/Chip level required.

Inside this Business Group


As the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth


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Deadline: 20-06-2024

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